Experimental branch update - hacking and engineering bay design pass

Main Changes:

• Hacking has been simplified, security is no longer consumed by your own hacking cards, instead they are powered by other enemy states in some cases, making them synergize more with cards outside of the hacking equipment.
  
• The Maintenance Bay is now an Ext Attachment equipment, using the torpedo pods as a placeholder model.
  
• The Disruptor hacking equipment has been renamed to **Inductor** , to prevent a naming clash with the Disruptor Ion cannon.
  
• The Lancer has a new starting equipment option, replacing the Inductor - the Smelter resource bay.
  
• The Engineering bays (Weapons, Shielding, Maintenance) and Hacking consoles (Suppressor, Corruptor, Inductor) now have upgradable cards.
  

The equipment changes:

Hacking:

• Weaken (3E, CD 6): Apply 1 Suppression for every attack card in the enemy’s hand. Hack
  
• Sap (2E, CD 6): -1 enemy Shield Duration. If already at 0, remove 5 Shield Points instead. Hack
  
• System Strain (2E, CD 7): Apply 1 Blind. If the enemy has Ionize: apply 2 instead. Hack
  
• Field Depletion (1M 2E, CD 6): Apply -1 Shielding to the enemy for the rest of the fight. Deplete, Hack
  
• Wipe (1M 3E, CD 8): Remove 1 enemy Buff. Hack
  
• Leech Defenses (3E, CD 7): Transfer 50% of the enemy’s next Shield card to you. Hack
  
• Sabotage (2E, CD 7): Increase the repair time of a random destroyed enemy equipment by 2. Hack
  
• Backlash (2M 3E, CD 8): For the rest of this fight, at turn end, each enemy weapon that attacked this turn takes 2 damage (3 if the enemy is Brittle). Deplete, Hack
  

• Thermal Tick (3E, CD 6): Enemy sustains 2 Heat for every card it plays on its next turn. Hack
  
• Hack Heatsinks (1M 3E, CD 7): Set enemy Heat tolerance to 0 for 1 turn. Hack
  
• Boiling Point (1M 3E, CD 7): Apply Heat equal to the enemy’s Heat tolerance. Deplete, Hack
  
• Exothermic Shields (2M 3E, CD 8): For this fight, the enemy sustains 3 Heat whenever you break its shield (4 if it has Coolant Loss). Deplete, Hack
  
• Thermal Relay (2E, CD 6): For the rest of this turn, the enemy sustains 1 Heat for every card you play. Hack
  
• Battery Fire (3E, CD 7): Enemy sustains 1 Heat for every 3 Shield Points. Hack
  
• Rupture (3E, CD 6): Enemy sustains 1 Coolant Loss for every attack it plays on its next turn. Hack
  
• Thermal Sensitivity (2M 2E, CD 8): For this fight, the enemy loses 3 Shield Points on turn end if Overheated. Deplete, Hack
  
• Thermal Amplifier (4E, CD 8): Double the enemy’s Heat. Hack (Mk.2 only)
  

• Restrain (2E, CD 7): Delay a random enemy weapon by 1 turn. If the enemy has Ionize: delay 2 random weapons instead. Hack
  
• Waylay (2E, CD 7): Turn the closest incoming missile into an outgoing Firefly. Requires: Incoming Missile. Hack
  
• Glitch (3E, CD 6): Disable targeted enemy equipment for 1 turn. Hack
  
• Reset (3E, CD 7): Discard a card from 1 random disabled equipment. If not available, disable a random equipment for 1 turn instead. Hack
  
• Prolong (3E, CD 6): Every disabled equipment stays disabled 1 turn longer. If none is, disable a random equipment for 1 turn instead. Hack
  
• Defrag (3E, CD 6): Remove your oldest Debuff. If you have Duration: goes on cooldown instead of depleting. Deplete
  
• Neutralize (1M 3E, CD 8): For 2 turns, disable a random enemy weapon at turn start. If the enemy is Overheated: +1 duration. Hack
  
• Pacify (4E, CD 8): Disable all enemy weapons for 1 turn. Deplete, Hack
  
• Reboot (2M 3E, CD 8): For 2 turns, disable an enemy equipment for 1 turn after it plays a card. If the enemy has any Suppression: +1 duration. Hack (Mk.2 only)
  

• Backdoor (2E, CD 6): Remove all enemy Security. Draw 1 card. (Aux exclusive)
  

Engineering Bays:

• Take Aim (2M, CD 5): This turn, your attacks deal +1 damage.
  
• Rapid Cycling (2M, CD 5): Attacks in your hand have their cooldown reduced by 2 this turn.
  
• Offensive Assurance (3M, CD 8): Deal +1 damage. Upkeep: Don’t take any hull damage.
  
• Pyrophoric Reaction (2M, CD 5): This turn, increase the Shred and Ignite value of your attacks by +1.
  
• Weapons Hot (2M, CD 6): Attacks you play this turn apply 1 Shred for every 3 hull damage dealt.
  
• Pin Down (2M, CD 6): This turn, Area attacks you play apply 1 Suppression to the enemy. (Triggers on play; a repeated attack counts twice.)
  
• Target Lock (3M, CD 8): +1 Precision damage. Upkeep: Play at least one attack per turn.
  
• Attack Mode (3M, CD 7): Draw 1 card after every attack played this turn.
  
• Streamline (3M 1E, CD 4): This turn, each Attack card played reduces the cost of all other Attack cards by 1 Ordnance. Deplete (Mk.2 only)
  
• Full Power (3M, CD 8): This turn, attacks that cost Ordnance cost 1 more Ordnance and deal +15% damage per Ordnance they cost. (Mk.2 only)
  

• Defensive Stance (2M, CD 6): Gain 2 Energy and draw a Shield card.
  
• Galvanize (2M, CD 6): This turn, Shield cards cost 1 Energy less and have their cooldown reduced by 1.
  
• Defense Lattice (4M, CD 8): Gain +1 Shielding. Upgrade
  
• Shock Absorbers (1M 1E, CD 7): Gain 2 Shield Points for each Ordnance spent on the next attack this turn.
  
• Emitter Surge (2M, CD 5): This turn, gain +2 Shielding.
  
• Feedback Loop (2M, CD 6): Gain 1 Energy for every 3 Shield Points you lose on the enemy’s next turn.
  
• Redundant Systems (3M, CD 7): This turn, your next Shield card is played twice.
  
• Collapse Flash (4M, CD 8): Each time your shields are broken by damage, apply 1 Blind to the enemy at the start of your next turn. Upgrade
  
• Absorption Coils (4M, CD 8): Each time your shields absorb a hit, your Laser attacks deal +1 damage until the end of your next turn. Upgrade
  
• Shield Configuration (4M, CD 8): If you’re Shielded when you play this, gain Focused shielding: take 25% less Precision damage while Shielded. If you’re not Shielded, gain Diffuse shielding: take 25% less Area damage while Shielded. Upgrade
  

• Disposable Plating (3M, CD 7): Gain 4 Temp. Hull.
  
• Service Support (2E, CD 6): This turn, for each other Support card you play: gain 1 Temp. Hull.
  
• Hull Assessment (2M, CD 5): Gain 2 Temp. Hull, or 4 if your hull is below 50% (Temp. Hull not counted).
  
• Jury-Rig (free, CD 6): Return a random other Support card from cooldown to your hand. If you took hull damage since your last turn ended: return 2.
  
• Patch Job (3M, CD 5): Remove 1 Brittle from your ship. If you have none: gain 3 Temp. Hull. Deplete
  
• Battle Repairs (CD 6): Repair 4 hull. Deplete
  
• Weaponized Scrap (4M, CD 8): Each time you take hull damage, your Kinetic attacks deal +1 damage until your turn ends. Upgrade
  
• Expand Capacity (5M, CD 8): +1 card slot this combat. All Expand Capacity cards cost +1 Mass this combat.
  
• Damage Control (4M, CD 8): Start of your turn: repair 1 hull per 2 hull lost on the enemy’s turn. Upgrade (Mk.2 only)